High Capacity Photonic Interconnected Systems
AIM Photonics via State University of New York (SUNY)
Area/s of Research:Electronics & Photonics
In this KTMA project we will use the AIM platform to design and demonstrate 400G/800G Si PIC transceivers optimized for the Datacenter market. The AIM Datacom team will work closely with the AIM Epitaxial laser team to integrate these PIC transceivers on a single Si platform with high-reliability epitaxially-grown lasers. This demonstration will leverage work on electrical and PIC transmitter elements developed in the 2018 project, along with new PIC designs and an electrical receiver circuit developed in the proposed 2019 project.