PI Name :
DOE Advanced Research Projects Agency-Energy (ARPA-E)
To develop a technology for scaling high efficiency datacenter and supercomputer photonics to 300 mm wafers at low cost with high performance. Successful development of the proposed technology can solve the bandwidth capacity bottleneck of electronic chips and reduce the power necessary for interconnecting ICs, addressing a major impending need for high volume, low power, low cost silicon photonic optical interconnects for data centers, supercomputers and fiber to the home (FTTH).
04/07/2016 to 04/06/2019
Related IEE Person:
Area/s of Research :
Electronics Photonics Materials